(1) Honorary General Chair (大會榮譽主席)，K. N. Chiang (江國寧)， 2026 IEEE International Microsystems, Packaging, Assembly and Circuit Technology Conference.

(2) Best Student Paper Award,  M. C. Huang, Y. C. Chen and K. N. Chiang，"Hybrid Machine Learning -Based Warpage Prediction for Fan-Out Panel Level Packaging", IEEE International Microsystems, Packaging, Assembly and Circuit Technology Conference.

(3) Best Student Paper Award, Y. T. Su, C. H. Lo and K. N. Chiang, "Parallel-Accelerated Neural Network-Based Lifetime Prediction and Design Optimization for Wafer-Level Packages Using Finite Element Simulation", IEEE International Microsystems, Packaging, Assembly and Circuit Technology Conference