1. Mechanical Simulation & Characterization 技術委員會共同主席 -  IEEE Electronics Packaging Technology Conference (IEEE EPTC2023, Singapore)
2. 應邀為IEEE EPTC國際研討會(新加坡) AI 大會論壇與談者 (Panelist: Artificial Intelligence for Package Design and Manufacturing)

3. 應邀為IEEE EPTC國際研討會(新加坡) Professional Development Course (PDC)講師 - Design-on-Simulation Technology for Advanced Packaging Reliability Life Prediction