1.蘇祐霆 （江國寧），Best Student Paper Award,  2025 International Microsystems, Packaging, Assembly and Circuits Technology Conferfence (IEEE), "Using Uncertainty Analysis to Validate Reliability Prediction in WLP with Idealized Solder Joint Modeling"

2.楊智安 （江國寧），Best Student Paper Award,  2025 International Microsystems, Packaging, Assembly and Circuits Technology Conferfence (IEEE), "Developing Pad Design Criteria for Wafer-Level Chip-Scale Package Through Pad Size Effect Analysis"