國立清華大學「微感測器與致動器產學聯盟」活動公告

時間：08/22/2025 (星期五) 下午 15:00-17:00

請於 2025/8/20 前上網報名:  http://goo.gl/forms/yfaIfF44UY

演講內容 (Abstract)

MEMS sensors serve as gears to connect people with their surroundings, and enable deeper perception and interaction to the environment. We are able to leverage the information that sensors perceive to develop functions that improve the quality of life. The rise in robotics, autonomous vehicles, smart homes, IoT, AR/VR/MR, and environmental hubs has become the driving force for the acceleration and development of MEMS sensors technology

ASE-CL offers a variety of sensor packaging solutions that leverage upon an established database of simulation, material properties and assembly experience to address dedicated sensor requirements of different microelectronic, optoelectronic, RF, biomedical device, sensor, actuator and microsystem applications. While traditional packaging is generally used to protect chips, MEMS packaging is integral to the functionality of the device. Each sensor device has unique packaging requirements to meet specific functions for interacting with external devices or the environment.

·     參加對象：對微系統領域有興趣之業界及學研界人士

·     名    額：由於座位有限，名額僅 100 人

請於 2025/8/20 前上網報名:  http://goo.gl/forms/yfaIfF44UY

·     費    用：一律免費

·     聯絡方式：

• 林金慧 小姐  國立清華大學動機系 
  Email: ch.lin@mx.nthu.edu.tw  電話: (03) 574-2494

 方維倫 講座教授  國立清華大學動機系

 Email: fang@pme.nthu.edu.tw  電話: (03) 574-2923

 李昇憲 講座教授  國立清華大學奈微所 

 Email: ssli@mx.nthu.edu.tw    電話: (03) 516-2401

主辦單位：國立清華大學「微感測器與致動器產學聯盟」(網址： http://www.usat.org.tw/)

                         SEMI Taiwan (網址：http://www.semi.org/ch/)

協辦單位：國立清華大學動機系、國立清華大學奈微所、國立清華大學工學院產學研

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