【書報討論】108/3/7 國立交通大學電子工程學系 陳冠能特聘教授（國際半導體產業學院副院長）
演講時間：108/3/7（四）15:30-17:00
演講地點：國立清華大學工程一館107演講廳
演講者：國立交通大學電子工程學系 陳冠能特聘教授（國際半導體產業學院副院長）
講題：3D Integration and Advanced Packaging
摘要：3D integration and advanced packaging have become more and more significant in current electronic products and applications because of their flexibility and ability to integrate different substrates, functions, devices, and products together with small form factor and low power consumption. While 3D integration is treated as a solution to extend “Moore’s Law”, advanced packaing based on 3D-integration-related technologies becomes a candidate to perform the concept of “More than Moore”. In addition, since current semicondutor development especially fcous on the potential and demands of AI and IOT. 3D Integration and advanced packaging provide the solutions to fabrications and platforms of various advanced electronic products. This lecture will start from the introduction of 3D integration and advanced packaging, including the history background and current semiconductor status. Schemes of 3D integration and advanced packaging such as 3D, 2.5D (interposer and CoWoS), and 2.1D (fanout and InFO) will be introduced. Key technologies to achieve these schemes, including bonding, TSV, handling, and thinning, will be presented next. We then will review current applications based on 3D integration and advanced packaging technologies. Finally, current status, challenges, and outlook will be discussed.
講者簡歷：Kuan-Neng Chen received his Ph.D. degree in Electrical Engineering and Computer Science, and his M.S. degree in Materials Science and Engineering, both from Massachusetts Institute of Technology (MIT). He is currently Distinguished Professor of Department of Electronics Engineering and Vice Dean of International College of Semiconductor Technology in National Chiao Tung University. Prior to the faculty position, he was a Research Staff Member at the IBM Thomas J. Watson Research Center.
Dr. Chen is the recipient of IEEE EPS Exceptional Technical Achievement Award, MOST Outstanding Research Award, NCTU Distinguished Faculty Awards, NCTU Outstanding Industry-Academia Cooperation Achievement Awards, CIE Outstanding Professor Award, CIEE Outstanding Professor Award, and IBM Invention Plateau Invention Achievement Awards. He has authored 280 publications, including 2 books and 6 book chapters, and holds 80 patents. He was Guest Editor of MRS Bulletin. He served as General Co-Chair of IEEE IITC and Program Co-Chair of IEEE IPFA, and committee member of IEDM, IEEE 3DIC, IEEE SSDM, IEEE VLSI-TSA, and IMAPS 3D Packaging. Dr. Chen is a member of Phi Tau Phi Scholastic Honor Society and IEEE Fellow. Dr. Chen’s current research interests are three-dimensional integrated circuits (3D IC), advanced packaging, and heterogeneous integration.
演講地點：國立清華大學工程一館107演講廳
演講者：國立交通大學電子工程學系 陳冠能特聘教授（國際半導體產業學院副院長）
講題：3D Integration and Advanced Packaging
摘要：3D integration and advanced packaging have become more and more significant in current electronic products and applications because of their flexibility and ability to integrate different substrates, functions, devices, and products together with small form factor and low power consumption. While 3D integration is treated as a solution to extend “Moore’s Law”, advanced packaing based on 3D-integration-related technologies becomes a candidate to perform the concept of “More than Moore”. In addition, since current semicondutor development especially fcous on the potential and demands of AI and IOT. 3D Integration and advanced packaging provide the solutions to fabrications and platforms of various advanced electronic products. This lecture will start from the introduction of 3D integration and advanced packaging, including the history background and current semiconductor status. Schemes of 3D integration and advanced packaging such as 3D, 2.5D (interposer and CoWoS), and 2.1D (fanout and InFO) will be introduced. Key technologies to achieve these schemes, including bonding, TSV, handling, and thinning, will be presented next. We then will review current applications based on 3D integration and advanced packaging technologies. Finally, current status, challenges, and outlook will be discussed.
講者簡歷：Kuan-Neng Chen received his Ph.D. degree in Electrical Engineering and Computer Science, and his M.S. degree in Materials Science and Engineering, both from Massachusetts Institute of Technology (MIT). He is currently Distinguished Professor of Department of Electronics Engineering and Vice Dean of International College of Semiconductor Technology in National Chiao Tung University. Prior to the faculty position, he was a Research Staff Member at the IBM Thomas J. Watson Research Center.
Dr. Chen is the recipient of IEEE EPS Exceptional Technical Achievement Award, MOST Outstanding Research Award, NCTU Distinguished Faculty Awards, NCTU Outstanding Industry-Academia Cooperation Achievement Awards, CIE Outstanding Professor Award, CIEE Outstanding Professor Award, and IBM Invention Plateau Invention Achievement Awards. He has authored 280 publications, including 2 books and 6 book chapters, and holds 80 patents. He was Guest Editor of MRS Bulletin. He served as General Co-Chair of IEEE IITC and Program Co-Chair of IEEE IPFA, and committee member of IEDM, IEEE 3DIC, IEEE SSDM, IEEE VLSI-TSA, and IMAPS 3D Packaging. Dr. Chen is a member of Phi Tau Phi Scholastic Honor Society and IEEE Fellow. Dr. Chen’s current research interests are three-dimensional integrated circuits (3D IC), advanced packaging, and heterogeneous integration.
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