【書報討論】107/11/22 Prof. Taek-Soo Kim, Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Republic of Korea
演講時間：107/11/22（四）15:30-17:00
演講地點：國立清華大學工程一館107演講廳
演講者：Prof. Taek-Soo Kim, Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Republic of Korea
講題：Strategies for Mechanically Reliable Thin-Film Flexible Electronics
摘要：Advanced thin films are ubiquitous and important in many modern technologies. Most prominent applications include microelectronic devices, fuel cells, solar cells, OLED displays for which electrical, electrochemical, and optical properties of thin films are critical. However, while significant efforts have been directed to improving those properties, mechanical integrity of the thin films has been often ignored and even sacrificed. For example, new materials with unknown mechanical properties are increasingly being used, and in many cases they turn out to have inferior mechanical reliability. To make matters worse, thin film devices are being attempted to be mounted on flexible and even stretchable substrates, and this dramatically increases film deformation and stress. All of these trends significantly sacrifice mechanical integrity of thin films and reduce device yield and reliability. This talk presents novel methods to measure and enhance mechanical properties of advanced thin films for flexible and stretchable electronics. Especially, 1) tensile testing of ultra-thin films on water surface and 2) adhesion and cohesion of advanced thin films are discussed.
演講地點：國立清華大學工程一館107演講廳
演講者：Prof. Taek-Soo Kim, Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Republic of Korea
講題：Strategies for Mechanically Reliable Thin-Film Flexible Electronics
摘要：Advanced thin films are ubiquitous and important in many modern technologies. Most prominent applications include microelectronic devices, fuel cells, solar cells, OLED displays for which electrical, electrochemical, and optical properties of thin films are critical. However, while significant efforts have been directed to improving those properties, mechanical integrity of the thin films has been often ignored and even sacrificed. For example, new materials with unknown mechanical properties are increasingly being used, and in many cases they turn out to have inferior mechanical reliability. To make matters worse, thin film devices are being attempted to be mounted on flexible and even stretchable substrates, and this dramatically increases film deformation and stress. All of these trends significantly sacrifice mechanical integrity of thin films and reduce device yield and reliability. This talk presents novel methods to measure and enhance mechanical properties of advanced thin films for flexible and stretchable electronics. Especially, 1) tensile testing of ultra-thin films on water surface and 2) adhesion and cohesion of advanced thin films are discussed.
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