【書報討論】107/9/27 Bruker NI (Hysitron), USA駐臺灣分公司 魏伯任應用科學家
演講時間：107/9/27（四）15:30-17:00
演講地點：國立清華大學工程一館107演講廳
演講者：Bruker NI (Hysitron), USA駐臺灣分公司 魏伯任應用科學家
講題：從量測的角度看大量生產The Introduction and Development of Mechanical Metrology at Nano-Scale from a Viewpoint of Mass Production
摘要：Advances in thin film deposition technologies and material development has enabled a wide range of industrial applications. Examples are very evident in the semiconductor/microelectronics, display, energy, optoelectronics, bio-medical, and many others industries. Decreasing film thicknesses and manufacturing complexities pose increasing challenges for academic researchers and industrial process control in the evaluation of mechanical properties. This has created a need for research and process grade metrology instrumentation with significantly enhanced precision in measuring a wide range of mechanical properties. Control of these ultra-thin films are extremely essential and present a challenge in measuring mechanical properties with highly precise force, displacement, and positioning. Interfacial adhesion, elastic /plastic response, modulus, fracture toughness, wear resistance, friction, and surface energy together with temperature, humidity, electrical environments become significantly more difficult in such thin films. In this presentation we will review many of the current challenges in thin film mechanical property analysis and present new and existing techniques that offer significant benefits for such challenging problems.
演講地點：國立清華大學工程一館107演講廳
演講者：Bruker NI (Hysitron), USA駐臺灣分公司 魏伯任應用科學家
講題：從量測的角度看大量生產The Introduction and Development of Mechanical Metrology at Nano-Scale from a Viewpoint of Mass Production
摘要：Advances in thin film deposition technologies and material development has enabled a wide range of industrial applications. Examples are very evident in the semiconductor/microelectronics, display, energy, optoelectronics, bio-medical, and many others industries. Decreasing film thicknesses and manufacturing complexities pose increasing challenges for academic researchers and industrial process control in the evaluation of mechanical properties. This has created a need for research and process grade metrology instrumentation with significantly enhanced precision in measuring a wide range of mechanical properties. Control of these ultra-thin films are extremely essential and present a challenge in measuring mechanical properties with highly precise force, displacement, and positioning. Interfacial adhesion, elastic /plastic response, modulus, fracture toughness, wear resistance, friction, and surface energy together with temperature, humidity, electrical environments become significantly more difficult in such thin films. In this presentation we will review many of the current challenges in thin film mechanical property analysis and present new and existing techniques that offer significant benefits for such challenging problems.
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