台積電誠徵工程師兩名

工作需求如下：

Package Modeling Engineer

Requirements:

   MS ME/Mat. Sci. /EE with 3+ years experience or PHD ME/Mat. Sci. /EE

   with 1+ years experience in thermal/mechanical engineering and working

   in the electronic packaging industry

   Expert level modeling experience with ANSYS, Hypermesh and LS-DYNA

   Experience in advanced packaging/ assembly process integration (ex.

   Wafer level packaging) is preferred

   Hands on experience in nonlinear warpage/stress, fracture, thermal

   fatigue and board drop analysis with ANSYS and LS-DYNA in electronic

   packaging and product design

   Ability to utilize engineering fundamentals to solve/analyze emerging

   customer issues

   Strong customer orientation, excellent communication and people skills

   are a must. Fluent in spoken Mandarin and English

2. Thermal Engineer

Requirements:

   MS ME/Mat. Sci. /EE with 3+ years experience or PHD ME/Mat. Sci. /EE

   with 1+ years experience in thermal/mechanical engineering and working

   in the electronic packaging industry or system company

   Expert level modeling experience with IcePAK, Flotherm or other CFD

   tools

   Hands on experience in package to system level thermal simulation for

   product design on advanced packaging

   Capabilities of design and data analysis of experiment are required

   Experience in IC design house/IDM is preferred

   Ability to utilize engineering fundamentals to solve/analyze emerging

   customer issues

   Strong customer orientation, excellent communication and people skills

   are a must. Fluent in spoken Mandarin and English

聯絡人

Po-Yao Lin 林柏堯

New Technology Management Program

Backend Technology and Service Division

Taiwan Semiconductor Manufacturing Company, Ltd.

Tel: 886-3-5636688 Ext. 7076019, 7075455

Fax: 886-3-5641737

Mobile: 886-0918572207

email: pylino@tsmc.com